In-Depth Research on Global Semiconductor Deposition Market 2016-2020

Report : Global Semiconductor Deposition Market 2016-2020 is a new market research publication announced by Reportstack.

Report Outline: Semiconductor deposition is a process or technique of depositing a thin layer of a material on the surface area of a wafer or substrate. The added layer acts as a conductor, an insulator barrier, or a customized surface on which the semiconductor device pattern is etched. Materials that are used for the deposition are silicon, filaments, silicon dioxide, carbon nanotubes, tungsten, silicon carbide, silicon oxynitride, carbon fiber, silicon nitride, titanium nitride, silicon-germanium, and a number of high-k dielectrics. The thickness of the deposited layer usually ranges from a few to around 100 nm. Certain deposition techniques such as molecular beam epitaxy involve the deposition of a single layer of atom on the surface of wafers at a time. However, in CVD technology, the wafer is exposed to one or more volatile precursors, which react or decompose on the surface to give the desired deposit.

For detailed report with TOC, please click here ​Global Semiconductor Deposition Market 2016-2020.

Market Growth: The global semiconductor deposition market is expected to grow at a CAGR of 16.03% during the period 2016-2020.

Key vendors: 
• Applied Materials
• ASM International
• Hitachi Kokusai Electric
• Lam Research
• Tokyo Electron

Other prominent vendors: 
• IQE 
• Plasma-Therm 
• Veeco Instruments

Regions Covered:

• Europe
• North America

Companies Mentioned

Applied Materials, ASM International, Hitachi Kokusai Electric, Lam Research, Tokyo Electron, AIXTRON, CANON ANELVA, IHI, IQE, Plasma-Therm, Veeco Instruments.


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